TO-220 package

 

TO-220 is a package used for high power applications. We see power transistors mostly in this package. In fact, if we see the full form of TO, it is Transistor Outline. The major advantage of this package is handling of high power dissipation in the package which is facilitated by the metal tab and the hole. We can have a heat sink fixed to the PCB using this hole on the tab. Below are such various scenarios:

Note that the heat sinks can be customized as per the space availability and heat dissipation demands. Thermal paste between the TO-220 component and the heat sink facilitates good thermal transfer.

• Standard lead-to-lead size of TO-220 package is 2.54mm