Some more PCB routing guidelines for Embedded engineers
- Categorize the signals into the High, Medium and Low Frequency signals before starting the placement and routing
- Identify and categorize the various sections like I/O including connectors, buffers and relevant drivers, processor/controller section, power supply, high speed interfaces
- Ensure that all the clock/oscillators/clock tree away from the I/O connectors. This helps to eliminate the parasitic coupling
- Ensure that the processor placement and related high frequency components away from the I/O connectors. The high frequency sections include for example DDR memory, High speed Flash
- One of the trick while routing high speed signals is that the high speed signals need to be routed first and then the low speed signals should be routed with proper isolation
- Careful floor planning to be done before starting the PCB Layout.
- Do not route any high speed signals or medium speed signals between the pads of components like resistor, capacitor, etc
- PCB Layout engineer along with design engineer should have knowledge of the standard to which system must be compliant
- Ensure proper ground guarding for the traces leading to a RF antenna
- Ensure that there are no impedance discontinuities to the path leading to antenna from the RF transceiver
- Ensure that no high frequency signals and especially the RF signals are routed closer to the edge of the boards
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