Thermal paste is a heat sink compound
used on top of the processors (whether it be graphical or central
processor), regulators for heat to follow smoothly to external
medium. The mechanical designers suggest using a heat sink based on
the thermal calculations. The principal behind using a heat sink in
that the operating temperature of the device should not exceed the
maximum specified ratings in the datasheet.
Operating temperature of a specific
heat generating device is calculated by summation of junction
temeparature and heat generated (Heat generated is the product of
thermal resistance and power of operation). When this sum exceeds
operating temperature specification that effect is catstrophic and
can lead to device failure.
So, we have to use heat sink on top to
enable the heat to escape from the device. Keep in mind that thermal
paste is filling the imprefections of heat sink. The heat sink will
be mounted on top of the device. Even though the heat sink is placed
on top of device touching it there will be a air gap in between. Air
is always a poor conductor of heat in which case another media must
enable smooth heat flow. For this purpose we use a thermal paste.
Thermal paste is a highly heat conductive paste.You mave have a large
heat sink with exception fin structure for smooth heat flow, but,
without a thermal paste the entire cost you have put on heat sink is
a mere waste.
The thermal paste applied on top can be
of different types. These can be electrically conductive as well as
non-conductive. In a electronic board, it is always prefferable to
use a non-conductive type. Cermaic based paste is one type of thermal
paste. Arctic silver is the most preffered thermal paste.
What is Integrated Heat Spreader?
Keep in mind that the modern processors
have a metal kind of enclosure for heat flow assistance. This we call
a integrated heat spreader (IHS).
I already have a heat sink compound
on the device. How do i clean it?
Usin Isopropyl
Alcohol. Use a isopropyl dipped smooth cloth to rub off the paste.
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